📋 Workflow
Full workflow, products add-to-cart directly1
Cleave bulk crystal
10 minSlice small pieces from the layered crystal with a blade.
💡 Tip Pick flat, defect-free regions
⚠️ Caution Some crystals are toxic; use PPE
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2
Tape peel
10 minFold and peel the tape repeatedly to thin the layers.
💡 Tip More folds give thinner flakes
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3
Transfer to substrate
15 minPress the tape onto a clean substrate, then peel slowly to leave flakes.
💡 Tip Press gently to avoid bubbles
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4
Locate by microscopy
30 minLocate thin flakes by optical microscope or AFM.
💡 Tip Interference contrast reveals layer number
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⚠️ 5 Common Beginner Mistakes
- ① Tape residue contaminates the surface
- ② Fast peeling shatters flakes
- ③ Dirty substrate won't hold
- ④ Excess pressure crushes flakes
- ⑤ Wrong region yields no flakes
❓ FAQ
+How to tell if single layer?
Use Raman, PL, or AFM height (≈0.3–1 nm).
+Need large flakes?
Optimize cleaving and substrate adhesion.
+Scale up possible?
Not really; use CVD or liquid exfoliation for scale.